收藏本站
Application Note 9862
High dV/dt spikes present in the output voltage waveform
under highly dynamic load application (high dI/dt) are due to
the ESR and the ESL of the output capacitance. These
spikes coincide with the transient load’s rising and falling
edges, and decreasing their amplitude can be achieved by
using lower ESR/ESL output capacitors (such as surface-
mount tantalum capacitors), and/or the addition of more
ceramic capacitors, which have inherently low ESR/ESL.
The addition of more input-side capacitance and decreasing
the input-side capacitor banks’ ESR can also help in
situations where the input-side ripple is affecting the output
regulation. Such an example is excessive ATX 3.3V ripple
reducing the collector-to-emitter voltage available for Q2
(2.5V setting), and thus inducing an output droop component
- in such instance, the addition of input-side capacitance and
reduction of the ESR component can reduce the output
excursion.
Conclusion
The HIP6500B and HIP6502B are sophisticated integrated
circuits that envelop all the required circuitry for ACPI
implementation in computer motherboards and computer
systems. The circuits employ intelligent switching methods
for smooth power plane transitions, noise immunity circuits
for nuisance trip avoidance, and a direct interface to the
south bridge and logical circuitry for simplified control and
configuration.
8
References
For Intersil documents available on the internet, see web site
http://www.intersil.com/
[1] Advanced Configuration and Power Interface
Specification, Revision 1.0, December 1996,
Intel/Microsoft/Toshiba.
(http://www.teleport.com/~acpi/).
[2] HIP6020 Data Sheet, Intersil Corporation, Power
Management Products Division, FN4683,
(http://www.intersil.com/).
[3] HIP6021 Data Sheet, Intersil Corporation, Power
Management Products Division, FN4684.
[4] ATX Specification, Version 2.02, October 1998, Intel
Corporation (http://www.teleport.com/~atx/).
[5] HIP6500B Data Sheet, Intersil Corporation, Power
Management Products Division, FN4870.
[6] HIP6502B Data Sheet, Intersil Corporation,
Power Management Products Division, FN4871.
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
HIP6501AEVAL1 EVALUATION BOARD ACPI HIP6501
HIP9011EVAL1Z BOARD EVALUATION FOR HIP9011
HM2H08P115LF HM2H08P115LF SHROUD STYLE B LF
HM2P12P1LF HM2 M INS STYLE N WIDE
HM2R06P1LF MILLIPACS RCP HSG
HM2SC22A8 HM2SC22A8-MILLIPACS 2R SHIELDING
HM2SC22B HM2SC22B-MPACS SHIELD COVERS
HMC6352-DEMO DEMONSTRATION BOARD FOR HMC6352
相关代理商/技术参数
HIP6500CB 制造商:Rochester Electronics LLC 功能描述:- Bulk
HIP6500CB-TS2490 制造商:Rochester Electronics LLC 功能描述:- Bulk
HIP6500EVAL1 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Multiple Linear Power Controller with ACPI Control Interface
HIP6501 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Triple Linear Power Controller with ACPI Control Interface
HIP6501A 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Triple Linear Power Controller with ACPI Control Interface
HIP6501A_04 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Triple Linear Power Controller with ACPI Control Interface
HIP6501ACB 功能描述:IC PWM TRIPLE POWER CTRLR 16SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 电源控制器，监视器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 应用:多相控制器 输入电压:- 电源电压:9 V ~ 14 V 电流 - 电源:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP（5x5） 包装:带卷 (TR)
HIP6501ACB-T 功能描述:IC PWM TRIPLE POWER CTRLR 16SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 电源控制器，监视器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 应用:多相控制器 输入电压:- 电源电压:9 V ~ 14 V 电流 - 电源:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP（5x5） 包装:带卷 (TR)